The 10 Deadly Sins Of SMT And Lead-Free Assembly

Objectives of the Workshop:

During the course of our assembly process audits and troubleshooting work, we tend to see trends in the types of errors and problems. In other words, a lot of people are making the same mistakes. The resulting process problems wreak havoc with an impact on assembly yields ranging from 5 to 20%.

In addition to this direct cost, there is also additional financial impact with regard to time spent reworking and repairing, the on corrective action by QC, Engineering and Management, and, of course, "do-over".

This workshop identifies the "deadly sins" of SMT assembly, both for Pb-free and "leaded" processes. Besides the symptoms and consequences of each type of error, root-cause, rectification and prevention techniques will be presented.

The workshop will, thus, provide the participant with an understanding of how to identify and correct the most common SMT assembly problems. It will include identification of vendor and source problems including components and materials as well as design related problems.

Topics Covered:

  1. The 10 Deadly Sins
  2. Solder Paste Printing
  3. Component Placement
  4. Reflow
  5. Wave-Soldering
  6. Repair, Rework and Touch-up<
  7. SPC
  8. Documentation
  9. MSD
  10. Design Related
  11. Lean Manufacturing

Who Should Attend:

This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies