Acronyms for SMT and Electronics Assembly
The acronyms related to any technical field today can be overwhelming. This is what we call our Short List. The Full List of SMT acronyms is available in our "Articles" section for registered users.
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- AAGR
- Average Annual Growth Rate
- AIS
- Adhesive Interconnect System
- AOI
- Automatic Optical Inspection
- AOQ
- Average Outgoing Quality
- AQL
- Acceptable Quality Level
- ARPA
- Advanced Research Projects Agency
- ASIC
- Application Specific Integrated Circuit
- ATE
- Automatic Test Equipment
- ATM
- Atmospheres
- AXI
- Automated X-Ray Inspection
- BGA
- Ball Grid Array; Bumped Grid Array
- BLP
- Bottom Leaded Packages
- BTAB
- Bumped Tape-Automated Bonding
- C4
- Controlled Collapse Chip Connection
- C5
- Controlled Collapse Chip Carrier Connection
- CAFM
- Computer Aided Facilities Management
- CAM
- Computer Aided Manufacturing
- CAPP
- Computer Aided Process Planning
- CAR
- Computer Aided Repair
- CAT
- Computer Aided Testing
- CBGA
- Ceramic Ball Grid Array
- CCA
- Circuit Card Assembly
- CCAPS
- Circuit Card Assembly And Processing System
- CCGA
- Ceramic Column Grid Array
- CDR
- Convection Dominant Reflow
- CFM
- Continuous Flow Manufacturing
- CGA
- Column Grid Array
- CIM
- Computer Integrated Manufacturing
- C/IR
- Convection/Infrared
- CIS
- Condensation Inert Soldering
- COB
- Chip On Board
- COC
- Certificate Of Compliance
- COF
- Chip On Flex
- CP
- Capability Performance
- CPI
- Continuous Process Improvement
- CSP
- Chip Scale Package
- DCA
- Direct Chip Attachment
- DFA
- Design For Assembly
- DFAA
- Design For Automated Assembly
- DFM
- Design For Manufacturability
- DFMAG
- Design For Manufacturability and Assembly Guidelines
- DFX
- Design For Excellence
- DPM
- Defects Per Million
- DPMO
- Defects Per Million Opportunities
- ECAD
- Electronic Computer Aided Design
- ECN
- Engineering Change Notice
- ECO
- Engineering Change Order
- EDA
- Electronic Design Automation
- EIS
- Engineering Information System
- EMPA
- Electronic Manufacturing Process Audit
- EMPC
- Electronic Manufacturing Process Certification
- ESD
- Electrostatic Discharge
- ESS
- Environmental Stress Screening
- FAC
- Forced Air Convection
- FAR
- Failure Analysis Report
- FCIP
- Flip Chip In Package
- FCC
- Flat Conductor Cable
- FEA
- Finite Element Analysis
- FLT
- Full Liquidus Temperature
- FOP
- Fineness Of Print (Stencil)
- FPT
- Fine Pitch Technology
- HAL
- Hot Air Leveling
- HALT
- Highly Accelerated Life Testing
- HASL
- Hot Air Solder Leveling
- IC
- Integrated Circuit
- ICAM
- Integrated Computer Aided Manufacturing
- ICT
- In-Circuit Test
- IEC
- International Electrotechnical Commission
- ILB
- Inner Lead Bonding
- IMC
- Intermetallic Compound
- IR
- Infrared
- JEDEC
- Joint Electronic Device Engineering Council
- JIT
- Just In Time
- KGB
- Known Good Board
- KGD
- Known Good Die
- LCCC
- Leadless Ceramic Chip Carrier
- LDT
- Liquidus Dwell Time
- LFEA
- Lead-Free Electronic Assembly
- LFM
- Lead-Free Manufacturing
- LGA
- Land Grid Array
- LOC
- Lead On Chip
- LSI
- Large Scale Integration
- MCM
- Multichip Module
- MELF
- Metal Electrode Leadless Face
- MCT
- Machine Capability Test
- MLB
- Multi-Layer Board
- MLPWB
- Multi-Layer Printed Wiring Board
- MRP
- Manufacturing Resource Planning
- MRP
- Material Requirement Planning
- MSD
- Moisture Sensitive Device
- NEMA
- National Electrical Manufacturers Association
- NEMI
- National Electronics Manufacturing Initiative
- NPI
- New Product Introduction
- OA
- Organic Acid
- OE
- Opto Electronic
- OLB
- Outer Lead Bonding
- OMPAC
- Over Molded Pad Array Carrier
- P/I
- Packaging And Interconnection
- P/IA
- Packaging And Interconnecting Assembly
- P/IS
- Packaging And Interconnecting Structure
- PAC
- Pad Array Carrier
- PBGA
- Plastic Ball Grid Array
- PCB
- Printed Circuit Board
- PCBA
- Printed Circuit Board Assembly
- PCGA
- Plastic Column Grid Array
- PCMCIA
- Personal Computer Memory Card International Association
- PGA
- Pin Grid Array
- PLCC
- Plastic Leaded Chip Carrier
- PNP
- Pick And Place
- PTH
- Plated Through Hole
- PWB
- Printed Wiring Board
- PWI
- Process Window Index
- QFP
- Quad Flat Pack
- RA
- Rosin Fully Activated
- RMA
- Rosin Mildly Activated
- ROSE
- Resistivity of Solvent Extraction
- SCRS
- Single Center Reflow Soldering
- SIR
- Surface Insulation Resistance
- SMA
- Surface Mount Assembly
- SMART
- Surface Mount And Related Technologies
(British SMT Organization & Suppliers)
- SMC
- Surface Mount Component
- SMD
- Surface Mount Device
- SMEMA
- Surface Mount Equipment Manufacturers Association
- SMOBC
- Solder Mask Over Bare Copper
- SMT
- Surface Mount Technology
- SMTA
- Surface Mount Technology Association
- SOIC
- Small Outline Integrated Circuit
- SOT
- Small Outline Transistor
- SPRS
- Single Pass Reflow Soldering
- TAB
- Tape Automated Bonding
- TBGA
- Tape Ball Grid Array
- Tg
- Glass Transition Temperature
- THT
- Through-Hole Technology
- TQM
- Total Quality Management
- TSOP
- Thin Small Outline Package
- TSSOP
- Thin Shrink Small Outline Package
- UFPT
- Ultra Fine Pitch Technology
- ULR
- Ultra Low Residue
- WI
- Wetability Index
- WLP
- Wafer Level Packaging
- WSI
- Wafer Scale Integration
- ZAF
- Z-Axis Adhesive Film
This is what we call our Short List. The Full Acronym List will soon be available to registered users. Click Here to register for access.
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