This course is intended to provide the participant with an understanding of how to identify and correct most SMT assembly problems. Vendor and design related problems will be thoroughly examined.
A step-by-step investigation of the assembly process with their related problems and remedies will help the participant achieve high-yield manufacturing. Workmanship standards are also presented and discussed.
The course provides problem-solving tools for those involved in the manufacturing of SMT circuit board assemblies.
Course Outline:
Who Should Attend:
This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the design or production of surface mount or mixed technology assemblies.
About The Instructor:
PHIL ZARROW
Mr. Zarrow is President and a co-founder of ITM, Incorporated. He has been involved with hybrid and PCB assembly for over 25 years and has chaired and instructed at numerous seminars and conferences and has been involved with setup and troubleshooting through-hole and SMT processes throughout the world as well as examining and working with emerging and leading-edge technologies, equipment and processes.
Mr. Zarrow is a past-director of the SMTA and is active in IPC, IMAPS and also authors the "On the Forefront" column in Circuits Assembly Magazine.
