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Board Talk

Best Practices in Electronics Assmbly Processes

Understanding and Implementing Best Practices in Electronic Assembly Processes

You have the responsibility and resources to improve the productivity of an assembly operation….what do you do? This course drives awareness and solutions to the adverse impact that non-optimal assembly practices and processes have on the product quality and financial success of electronic assembly businesses. A comprehensive perspective on problem issues is developed for the most currently critical electronic assembly process, materials (both existing and emerging), equipment, procedures, and methods. Most importantly, practical solutions are presented. Key issues that consistently result in assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing assembly line operations including managers, line supervisors and line engineers involved in manufacturing, design and quality engineering.

Course Instructors: Joe Belmonte, Jim Hall and/or Phil Zarrow

Duration: 2 Days

Topics Covered:

Day 1:

  • Introduction
  • Optimization Objective
    • Getting the most productivity from an existing line
    • Definition of “Best Practices”
  • Some “Deadly Sins” of SMT Assembly
  • Best Practices in the Assembly Process
  • Solder Paste Printing process best practices
  • Pick and Place best practices
  • Reflow soldering best practices
  • Wave and Selective soldering best practices
  • Conformal Coating best practices

Day 2:

  • Soldering Problem Failure Analysis
  • Best Practices concerning “challenging technologies”
    • QFNs
    • Ultra-miniature components (0201s, 01005s, ultra-fine pitch BGAs and CSPs
  • Process Optimization best practices
    • Data driven process design
    • Practical use of Design of Experiments (DOE) in electronic manufacturing
    • Practical use of Statistical Process Control (SPC) in electronics manufacturing
    • Manufacturing organization best practices
  • Q & A

Who Should Attend:

This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.