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On-Site SMT Manufacturing Workshops


Surface Mount Technology Manufacturing

These courses are intended to give the participant a true comprehension of the SMT assembly processes and associated materials. High manufacturing yield can best be attained by understanding and successfully implementing the appropriate process considerations.

Course Ais a one day overview of the various facets of SMT including components, materials, equipment, and processes.

Course Bis a two day seminar offering a more comprehensive understanding of the SMT assembly process. The SMT concept is reviewed along with the different types of SMT assemblies. SMT processes and equipment including solder paste printing, adhesive dispensing, component placement, reflow and wave soldering, cleaning, inspection and rework are examined in depth. The course also covers material selection considerations including substrate, solder paste and components as well as key design criteria. Technology directions such as Fine Pitch technology, BGAs, as well as No-clean and other CFC alternatives are also examined.

Considerations In Outsourcing SMT To Contract Assembly

This one day course is designed to provide participants with an understanding of the outsourcing process from start to finish.. It reviews the basic SMT processing, PCB design principles, supplier selection concerns and the fundamentals of maintaining a successful on-going relationship with the chosen suppliers. Whether you are just getting into outsourcing assemblies or are already doing it, this course gives you an overview of what goes on behind the scenes so that you can reduce your manufacturing costs and lead times.

Stencil Printing and Inspection in the SMT Process

This one day course is intended to give the participant an overview of the SMT assembly processes and a comprehension of how the stencil printing and inspection processes fit into the overall SMT assembly line. Screen/Stencil Printing and Inspection will be discussed in depth so that the participants have a clear understanding of the fundamentals of the process. The various aspects of solder paste and adhesives will also be covered. The course incorporates hands-on activities with stencil printing equipment and materials.

How to Implement the No-Clean Solder Process

An one day course is designed to give the participant a good understanding of the No-clean process. The composition and characteristics of the different types of No-clean solder pastes and fluxes are discussed. Equipment and process parameters are examined along with the risks and demands of the process. Solder paste evaluation procedures and guidelines for integrating No-clean into the assembly process are presented.

Emerging Technologies: Packaging, Materials, and Processing Trends in SMT

This one day course covers current and future process directions. Topics include No-clean and water-soluble solder pastes, fine pitch device requirements, ball grid array (BGA) requirements, chip-scale, conductive adhesives, Single Center Reflow Soldering, and Single Pass Reflow Soldering. Lead-free solder alloys, Flip-chip, Chip on Board (COB), Tape Automated Bonding (TAB), PCMCIA and Multichip Modules (MCM) are also examined.

High Reliability SMT Manufacturing

An advanced, one day SMT manufacturing course intended for those already involved in the area who want to improve their yields. Part I deals with Pre-process requirements and considerations including design, fabrication, solder paste and components. Solder paste deposition and equipment parameters are examined in great detail in Part II. Part III explores the aspects of reflow including profiling, process and equipment. (Note - troubleshooting is covered in both parts). Finally, Workmanship Standards are reviewed.

SMT Mass Reflow Soldering

Detailed one day course on mass reflow soldering technique and processes. Part I covers methodology and process including thermal considerations, metallurgical and chemical requirements of solder paste, wavesoldering and reflow technologies including Convection, Convection/IR, Area Conductive and Condensation Inert (Vapor Phase) are also examined. Part II is concerned with equipment selection and a matrix is presented with review of the selection parameters. Part III deals with evaluating equipment and presents 10 tests.

ITM on-site courses are tailored to focus on the specific requirements of the client in terms of content and text material. Other topics are also available.

For further information regarding course content, pricing and scheduling, please use the contact form or call +1 603 868-1754