This one day course covers current and future process directions. Topics include lead-free solder alloys, flip-chip, chip on board (COB), tape automated bonding (TAB), PCMCIA, multichip modules (MCM), MEMS and MOEMS.
Requirements for lead-free, fine pitch devices, ball grid array (BGA), chip-scale packages, conductive adhesives single center reflow soldering, single pass reflow soldering, and advances in inspection technologies.
For more information, please contact: itm@itmconsulting.org
