A hybrid technology exclusively employing face-up-bonded chip devices interconnected to the substrate conventionally, i.e., by flying wires. A generic term for mounting an unpackaged silicon die directly onto the PCB.
Connections can be made by wire bonding, tape automated bonding (TAB), or flip-chip bonding.
Chip: A single substrate on which all the active and passive circuit elements have been fabricated using one or all of the semiconductor techniques of diffusion, passivation, masking, photoresist, and epitaxial growth.
A chip is not ready for use until packaged and provided with external connectors.
