Integrated circuit package in which the input and output points are solder bumps arranged in a grid or area array pattern.
CBGA devices utilize ceramic materials because of their low loss qualities, long life characteristics, and ability to withstand high operating temperatures and heat shock.
For general application, the aluminum oxide substrate (alumina) is preferred because of its availability, low cost, good thermal expansion coefficient to most inks. Beryllia substrates with a high thermal conductivity may be used in high power circuitry.
