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Articles on Electronics Assembly and SMT

From this page you can access articles written by or pertaining to ITM. Some articles will be made publicly available, but most will require registered access. There is no charge for registration.

As you can see in the Table of Contents below, you'll find information on SMT and through-hole technologies, soldering and solderability, component placement, BGAs, paste printing, emerging technologies and lead-free soldering among others.

In addition, you will be able to access the complete collection of Phi Zarrow's award winning column, published in Circuits Assembly magazine.

Register for access by clicking on the link below. We will send you an e-mail with a user name and password.

Register for Access to Articles

Public Articles

Private Content (Registered Users)

  • 2-D X-Ray Evolves
  • Fear and Loathing with Double Sided Reflow Soldering
  • Anisotropic Adhesives
  • Apocalypse RoHS by Dr. H. J. Zapfardt
  • Assembly Innovations
  • Automated Optical Inspection: The Key to Controlling the Process - Part 1
  • Automated Optical Inspection: The Key to Controlling the Process - Part 2
  • Evaluating Solder Paste
  • Automatic Component Placement Systems
  • Automation vs. Manual Assembly
  • Forsake Not Thy Stencil
  • Beware the Jabberwocky
  • Leadfree Reliability
  • BGA and Concurrent Process Engineering
  • Moisture Sensitive Devices - Not A Dry Subject
  • More...