Advanced SMT Manufacturing
- Equipment, Processes and Practices
Objectivves of this Course
This advanced, one-day course is intended to provide the experienced participant with a thorough yet practical overview of Surface Mount Technology manufacturing. High manufacturing yield can best be attained by understanding and successfully implementing the appropriate process considerations.
This workshop will give the participant a true comprehension of the SMT assembly processes and associated materials. The SMT assembly process will be covered, step by step including Screen/Stencil Printing, Component Placement, Reflow and Inspection as well as the various aspects of solder paste, design considerations, inspection and rework.
The impact of lead-free and RoHS compliance will also be examined for all processes. Numerous case studies based upon the instructor's experience will be presented. Most important, particular attention will be paid to the sources of problems that occur within the assembly process.
Topics Covered:
Introduction: The SMT Concept
SMT Process Philosophy
Lead-Free and RoHS
Design for Manufacturability Considerations (Overview)
Manufacturing Concerns for PCB Design
Solder Paste
Solder Paste Composition and Behavior
Fluxes: RMA, Water Soluble, No-cleans
Specification Development
Lead-Free Issues and Concerns
Solder Paste Printing and Deposition
Deposition Basics
Screen and Stencil Engineering
Control and Variables
Machine Elements and Parameters
Machine and Operator Interaction
Lead-Free Issues and concerns
Component Considerations
Types of Components
Moisture Sensitive Devices (MSD)
Classification
Handling
Tracking
Automatic Component Placement
Categorization of Automatic Placement Equipment (Levels I through V)
